An ALE Model for Prediction and Control of the Microvia Fill Process with Two Additives

Microvia Fill Process Boundary Control

This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying...

Publication P8 A. Pohjoranta and R. Tenno. 2007. Modelling of surfactant mass balance for microvia fill monitoring. In: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP

The mass balance of surface-adsorbing additives in a microvia filling bath is modeled. The model considers the additives’ mass balance between both the solution and the surface-adsorbed layer of additives, as well as on a shapechanging cathode surface, where mass balance of the additives is affected by the surface shape changes. The model is implemented as a finite element model, which applies ...

Computational Models for Microvia Fill Process Control

OF DOCTORAL DISSERTATION AALTO UNIVERSITY SCHOOL OF SCIENCE AND TECHNOLOGY P. O. BOX 11000, FI-00076 AALTO http://www.aalto.fi Author Antti Pohjoranta Name of the dissertation Manuscript submitted October 26, 2009 Manuscript revised February 3, 2010 Date of the defence March 19, 2010 Article dissertation (summary + original articles) Monograph Faculty Department Field of research Opponent(s) Su...

Publication P1 A. Pohjoranta and R. Tenno. 2007. A method for microvia-fill process modeling

Exact Controls for the Superconformal via Fill Process

This paper reports a means for stabilizing the microvia ll ratio on a desired level, using the total plating time and the system galvanostat setpoint current density as optimal controls. Both control variables are solved as functions of the process state as well as selected manufacturer preference variables that are typical for the via ll technology applied in multilayered printed circuit board...